Ulwazi olusisiseko lwezihlanganisi
Izixhobo zecandelo lesidibanisi: izinto zoqhagamshelwano zetheminali, izinto zokubeka i-plating, kunye ne-insulating material yeqokobhe.
Izixhobo zoqhagamshelwano
Izinto zokufaka umtya wokudityaniswa kokudibanisa
Izinto ezigqumayo kwiqokobhe lesihlanganisi
Kuzo zonke ezi zinto zingasentla, ungakhetha isinxibelelanisi esifanelekileyo ngokweyona ndlela yokusetyenziswa.
Iimeko zesicelo kwizihlanganisi
Izithuthi, unyango, ubukrelekrele bokwenziwa, i-aerospace, i-automation ye-industrial, izixhobo zasekhaya, i-Intanethi yeZinto, iziseko zenethiwekhi kunye nokunye.
engenamntu
ezonyango
AI
I-Aerospace
ishishini elizenzekelayo
izixhobo zekhaya
I-Intanethi yezinto
iziseko zophuhliso zothungelwano
Ukukhetha isiqhagamshelo kunye nokusetyenziswa
Ngokuphathelele ukhetho lwekhonkco kunye nokusetyenziswa, kukho iindlela ezintathu eziphambili zoqhagamshelwano:
1. Isidibanisi sebhodi ukuya kwibhodi
Ibhodi ebhityileyo ukuya ebhodini/ibhodi-ukuya-FPC izihlanganisi
Isidibanisi sokucinezela
Iziqhagamshelo zihlangene kakhulu kwaye zinemigangatho ephantsi yokucubungula i-1.20 kunye ne-1.63 mm, ukunciphisa ukuphakama okuthe nkqo kunye nesithuba sebhodi yesekethe eprintiweyo yokudibanisa iimodyuli ze-elektroniki kwii-ultra-thin portable devices.
Inkqubo yokudibanisa iMicro-Fit
Ibonelela ngeempawu zezindlu eziphezulu ezithintela ukungahambi kakuhle, ukunciphisa umva wesiphelo, kunye nokunciphisa ukudinwa kwabaqhubi ngexesha lendibano.
2. I-wire-to-board connector
Inkqubo yokudibanisa i-Mini-Lock ye-wire-to-board
Inkqubo egutyungelwe ngokupheleleyo, eguquguqukayo yocingo ukuya ebhodini/ucingo ukuya kwi-ingcingo kuluhlu olubanzi lwe-2.50 mm ye-pitch kushishino lwemigangatho yezicelo ezibandakanya i-engile yasekunene kunye neentloko ze-engile zasekunene.
Pico-Clasp ngocingo-to-ibhodi isidibanisi
Ifumaneka kwiindidi ezahlukeneyo zokukhwelana kunye nokuqhelaniswa, kunye ne-zinc okanye i-plating yegolide, ukubonelela ukuguquguquka koyilo kwizicelo ezininzi ezihlangeneyo.
3. Umdibaniso wocingo ukuya kwingcingo
Inkqubo yokudibanisa iMicroTPA
Ilinganiswe kwi-105 ° C, ubungakanani beesekethe ezahlukeneyo kunye noqwalaselo lukhoyo, okwenza le nkqubo ilungele izicelo zemarike jikelele.
Isidibanisi semodyuli ye-SL
Ifumaneka kwiimodeli ezininzi ezahlukeneyo kunye noqwalaselo, kubandakanywa iintloko zesokethi ezinobushushu obuphezulu ezinokumelana nobushushu be-260˚C kunye neenkqubo zokuphinda zithengiselwe.
Ukwenza iiseti ze-wire-to-wire connectors, udinga iiplagi, iisokethi, izikhonkwane zesilisa, kunye nezikhonkwane zabasetyhini. Umfanekiso umi ngolu hlobo lulandelayo:
iplagi
isiseko
Iphini yendoda
Iphini lomfazi
Ngokuqhelekileyo, iiplagi zisetyenziswa kakhulu ngezikhonkwane zamadoda, kwaye iziseko zisetyenziswa kakhulu ngezikhonkwane zabasetyhini. Kukho neemveliso ezisebenzisa zombini izikhonkwane zamadoda nabasetyhini. Oku kufuna uluhlu oluthile lweemveliso.
Oku ngasentla kudwelisa kuphela ezinye izihlanganisi kunye neendlela ezintathu zoqhagamshelwano ngokusekelwe kwimifanekiso yereferensi. Ngokuphathelele ukhetho oluthile, isisombululo esifanelekileyo sinokukhethwa ngokwemizobo yophawu ngalunye.
Ixesha lokuposa: Nov-07-2023