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Ngaba uyazazi iziseko zeziqhagamshelo?

Ulwazi olusisiseko lwezihlanganisi

Izixhobo zecandelo lesidibanisi: izinto zoqhagamshelwano zetheminali, izinto zokubeka i-plating, kunye ne-insulating material yeqokobhe.

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Izinto zoqhagamshelwano

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Izinto zokufaka umtya wokudityaniswa kokudibanisa

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Izinto ezigqumayo kwiqokobhe lesihlanganisi

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Kuzo zonke ezi zinto zingasentla, ungakhetha isinxibelelanisi esifanelekileyo ngokweyona ndlela yokusetyenziswa.

Iimeko zesicelo kwizihlanganisi

Izithuthi, unyango, ubukrelekrele bokwenziwa, i-aerospace, i-automation ye-industrial, izixhobo zasekhaya, i-Intanethi yeZinto, iziseko zenethiwekhi kunye nokunye.

engenamntu

ezonyango

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AI

I-Aerospace

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ishishini elizenzekelayo

izixhobo zekhaya

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I-Intanethi yezinto

iziseko zophuhliso zothungelwano

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Ukukhetha isiqhagamshelo kunye nokusetyenziswa
Ngokuphathelele ukhetho lwekhonkco kunye nokusetyenziswa, kukho iindlela ezintathu eziphambili zoqhagamshelwano:

1. Isidibanisi sebhodi ukuya kwibhodi

Ibhodi ebhityileyo ukuya ebhodini/ibhodi-ukuya-FPC izihlanganisi

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Isidibanisi sokucinezela

Izixhumi zidibene kakhulu kwaye zinemigangatho ephantsi yokucubungula i-1.20 kunye ne-1.63 mm, ukunciphisa ukuphakama okuthe nkqo kunye nesithuba sebhodi yesekethe eprintiweyo yokudibanisa iimodyuli ze-elektroniki kwii-ultra-thin portable devices.

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Inkqubo yokudibanisa iMicro-Fit
Ibonelela ngeempawu zezindlu eziphezulu ezithintela ukungahambi kakuhle, ukunciphisa umva wesiphelo, kunye nokunciphisa ukudinwa kwabaqhubi ngexesha lendibano.

2. I-wire-to-board connector

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Inkqubo yokudibanisa i-Mini-Lock ye-wire-to-board
Inkqubo egutyungelwe ngokupheleleyo, eguquguqukayo yocingo ukuya ebhodini/ucingo ukuya kwi-ingcingo kuluhlu olubanzi lwe-2.50 mm ye-pitch kushishino lwemigangatho yezicelo ezibandakanya i-engile yasekunene kunye neentloko ze-engile zasekunene.

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Pico-Clasp ngocingo-to-ibhodi isidibanisi
Ifumaneka kwiindidi ezahlukeneyo zokukhwelana kunye nokuqhelaniswa, kunye ne-zinc okanye i-plating yegolide, ukubonelela ukuguquguquka koyilo kwizicelo ezininzi ezihlangeneyo.

3. Umdibaniso wocingo ukuya kwingcingo

Inkqubo yokudibanisa iMicroTPA
Ilinganiswe kwi-105 ° C, ubungakanani beesekethe ezahlukeneyo kunye noqwalaselo lukhoyo, okwenza le nkqubo ilungele izicelo zemarike jikelele.

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Isidibanisi semodyuli ye-SL
Ifumaneka kwiimodeli ezininzi ezahlukeneyo kunye noqwalaselo, kubandakanywa iiheader zesokethi ezinobushushu obuphezulu ezinokumelana ne-260˚C ubushushu bokuthengisa kunye neenkqubo zokuphinda zithengiselwe.

Ukwenza iiseti ze-wire-to-wire connectors, udinga iiplagi, iisokethi, izikhonkwane zesilisa, kunye nezikhonkwane zabasetyhini.Umfanekiso umi ngolu hlobo lulandelayo:

iplagi

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isiseko

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Iphini yendoda

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Iphini lomfazi

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Ngokuqhelekileyo, iiplagi zisetyenziswa kakhulu ngezikhonkwane zamadoda, kwaye iziseko zisetyenziswa kakhulu ngezikhonkwane zabasetyhini.Kukho neemveliso ezisebenzisa zombini izikhonkwane zamadoda nabasetyhini.Oku kufuna uluhlu oluthile lweemveliso.
Oku ngasentla kudwelisa kuphela ezinye izihlanganisi kunye neendlela ezintathu zoqhagamshelwano ngokusekelwe kwimifanekiso yereferensi.Ngokuphathelele ukhetho oluthile, isisombululo esifanelekileyo sinokukhethwa ngokwemizobo yophawu ngalunye.


Ixesha lokuposa: Nov-07-2023